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| SSM3J304T TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type SSM3J304T Power Management Switch Applications High-Speed Switching Applications * * 1.8 V drive Low ON-resistance: Ron = 297 m (max) (@VGS = -1.8 V) Ron = 168 m (max) (@VGS = -2.5 V) Ron = 127 m (max) (@VGS = -4.0 V) Unit: mm Absolute Maximum Ratings (Ta = 25C) Characteristic Drain-source voltage Gate-source voltage Drain current Drain power dissipation Channel temperature Storage temperature DC Pulse Symbol VDS VGSS ID IDP PD (Note 1) Tch Tstg Rating -20 8 -2.3 -4.6 700 150 -55~150 Unit V V A mW C C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). JEDEC JEITA TOSHIBA 2-3S1A Weight: 10 mg (typ.) Note 1: Mounted on an FR4 board 2 (25.4 mm x 25.4 mm x 1.6 t, Cu Pad: 645 mm ) Electrical Characteristics (Ta = 25C) Characteristic Drain-source breakdown voltage Drain cutoff current Gate leakage current Gate threshold voltage Forward transfer admittance Symbol V (BR) DSS V (BR) DSX IDSS IGSS Vth Yfs RDS (ON) Ciss Coss Crss ton toff VDSF VDD = -10 V, ID = -1A, VGS = 0 ~ -2.5 V, RG = 4.7 ID = 2.3 A, VGS = 0 (Note 2) Turn-on time Turn-off time VDS = -10 V, VGS = 0, f = 1 MHz Test Condition ID = -1 mA, VGS = 0 ID = -1 mA, VGS = +8 V VDS = -20 V, VGS = 0 VGS = 8 V, VDS = 0 VDS = -3 V, ID = -1 mA VDS = -3 V, ID = -1 A ID = -1.0 A, VGS = -4 V Drain-source ON-resistance ID = -0.5 A, VGS = -2.5 V ID = -0.2 A, VGS = -1.8 V Input capacitance Output capacitance Reverse transfer capacitance Switching time (Note 2) (Note 2) (Note 2) (Note 2) Min -20 -12 -0.3 2.4 Typ. 4 88 120 172 335 70 56 20 20 0.85 Max -10 1 -1.0 127 168 297 1.2 ns V pF m Unit V A A V S Drain-source forward voltage Note 2: Pulse test 1 2007-11-01 SSM3J304T Switching Time Test Circuit (a) Test circuit 0 -2.5 V OUT IN RG RL VDDx VDD = - 10 V RG = 4.7 Duty 1% VIN: tr, tf < 5 ns Common Source Ta = 25C (b) VIN 0V 10% -2.5 V 90% (c) VOUT VDS (ON) 90% 10% tr ton to tf VDD Marking 3 Equivalent Circuit (top view) 3 JJ2 1 2 1 2 Notice on Usage Vth can be expressed as the voltage between gate and source when the low operating current value is ID = -1 mA for this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on).) Take this into consideration when using the device. ) Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. 2 2007-11-01 SSM3J304T ID - VDS -5 -10 -4 -2.5 Common Source Ta = 25 -10 Common Source VDS = -3 V -1 ID - VGS -4 Drain Current ID (A) -3 Drain Current ID (A) -1.8 -0.1 25 -2 -1.5 -1 VGS = -1.2 V 0 0 -0.2 -0.4 -0.6 -0.8 -1 -0.01 Ta = 85 -25 -0.001 -0.0001 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -2.2 -2.4 Gate-Source Voltage VGS (V) Drain-Source Voltage VDS (V) RDS (ON) - VGS 300 -0.5 A Common Source Ta = 25 RDS (ON) - Ta 300 Common Source 250 -1.8 V,-0.2 A ID = -1 A Drain-Source ON-Resistance RDS (ON) (m) 200 -0.2 A Drain-Source ON-Resistance RDS (ON)() 200 -2.5 V,-0.5 A 150 100 100 VGS = -4 V,ID = -1 A 50 0 0 1 2 3 4 5 6 7 8 9 10 0 -60 -35 -10 15 40 65 90 115 140 Gate-Source Voltage VGS (V) Ambient Temperature Ta ( ) RDS (ON) - ID 300 VGS = -1.8 V 250 Gate Threshold Voltage Vth (V) -1.4 Vth - Ta Common Source Ta = 25 -1.2 Common Source ID = -1 mA VDS = -3 V Drain-Source ON-Resistance RDS (ON) (m) -1 200 -0.8 150 -2.5 V -0.6 100 -4 V -0.4 50 -0.2 0 0 -1 -2 -3 -4 -5 -0 -25 0 25 50 75 100 125 150 Drain Current ID (A) Ambient Temperature Ta ( ) 3 2007-11-01 SSM3J304T |Yfs| - ID 10 Common Source VDS = -3 V Ta = 25 Forward Transfer Admittance |Yfs| (S) IDR - VDS 10 Common Source VGS = 0 Ta = 25 1 25 25 Ta = 85 1 -25 Drain Reverse Current IDR (A) 0.1 -25 0.01 Ta = 85 0.1 -0.01 0.001 -0.1 Drain Current ID (A) -1 -10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Drain-Source Voltage VDS (V) C - VDS 1000 1000 t - ID Ciss toff Common Source VDD = -10 V VGS = 0 -2.5 V Ta = 25 Switching Time t (ns) Capacitance C (pF) 100 tf 100 Coss Crss Common Source VGS = 0 V f = 1 MHz Ta = 25 10 -0.1 -1 -10 -100 ton 10 tr 1 0.01 0.1 Drain Current ID (A) 1 10 Drain-Source Voltage VDS (V) Dynamic Input Characteristic -10 Common Source (V) ID = -2.3A -8 Ta = 25C VGS Gate-Source voltage -6 VDD=-16V -4 -2 0 0 2 4 6 8 10 12 14 16 Total Gate Charge Qg (nC) 4 2007-11-01 SSM3J304T rth 1000 - tw Drain power dissipation PD (mW) 1000 PD - Ta a: Mounted on FR4 board (25.4mm x 25.4mm x 1.6t , Cu Pad : 645 mm2) b: Mounted on FR4 board (25.4mm x 25.4mm x 1.6t , 2 Cu Pad : 0.8 mm x3) Transient thermal impedance Rth (C/W) b 800 a 100 a 600 400 b 10 Single Pulse a: Mounted on FR4 board (25.4mm x 25.4mm x 1.6t , Cu Pad : 645 mm2) b: Mounted on FR4 board (25.4mm x 25.4mm x 1.6t , Cu Pad : 0.8 mm2x3) 200 1 0.001 0.01 0.1 1 10 100 1000 0 -40 -20 0 20 40 60 80 100 120 140 160 Pulse width tw (s) Ambient te perature Ta (C) 5 2007-11-01 SSM3J304T RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 20070701-EN GENERAL * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2007-11-01 |
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